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BGA flip chip underfill epoxy adhesive, China

Category: Local business

Address details

Guangdong

Guangdong, China Print route » N0° 0' 0" E0° 0' 0"   (0, 0) Start navigation »

Phone & WWW

http://www.epoxyadhesiveglue.com/case-in-usa-american-partners-chip-underfill-solution/

Business hours

Info

DeepMaterial Is Low Temperature Cure BGA Flip Chip Underfill PCB Epoxy Process Adhesive Glue Material Manufacturer And High Temperature-Resistant Underfill Coating Material Supppliers,Supply One Component Epoxy Underfill Compounds,Epoxy Underfill Encapsulant,Underfill Encapsulation Materials For Flip Chip In PCB Electronic Circuit Board,Epoxy-Based Chip Underfill and COB Encapsulation Materials And So On.

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